HITULCD

OEM & ODM Display Manufacturing Services

From Custom Design to Mass Production — One Factory, Zero Middlemen

Shenzhen Hantu Jiashi Technology Co., Ltd. (HITULCD)

What We Offer

HITULCD supports two engagement models for global brands, integrators and distributors who need a display product tailored to their own project, brand or enclosure — rather than an off-the-shelf panel.

OEM (Original Equipment Manufacturer)

We manufacture and modify existing HITULCD product platforms to your specification: your brand name and logo on the housing and packaging, custom colour/finish, adjusted interfaces, firmware branding (boot logo/UI), and packaging redesign — built on our proven, already-qualified hardware platforms to shorten development time.

ODM (Original Design Manufacturer)

We design and engineer a display product from a blank sheet based on your mechanical, electrical and environmental requirements — custom enclosure, custom PCB/driver board, custom optical bonding, and custom size/brightness/touch configuration — when no existing platform fits your project.

Core Manufacturing Capabilities

1. LCD Module Bonding (COG / FOG)

Automated Chip-on-Glass and Film-on-Glass bonding lines support custom LCD module development, with micron-level alignment control, stable signal transmission and long service life.

• Key equipment: JYD-I900E Full-Automatic COG Series

• Key equipment: JYD-F900E / F900A Atomization Bonding System

2. Structural & Assembly Integration

From backlight module rework to complete open-frame monitor assembly, our automated cutting, gluing and assembly lines support flexible customization while holding stable mass-production quality.

• Key equipment: GH-1111 Laser Cutting Machine (7.5KW fiber laser, burr-free edge cutting)

• Key equipment: OC-1200A OC Glass Cutting Machine (precision optical-clear glass cutting)

• Key equipment: Full-Automatic Laminating & Gluing Production Line

• Key equipment: LS-900Pro Laser Marking Machine (high-precision marking/micro-processing)

• Key equipment: PT-A12-B Automatic Mounter (5.5KW, high-speed SMT placement)

• Key equipment: F6-AS120 ACF Laminating Machine (conductive film lamination for stable circuit connection)

3. Reliability Testing & Quality Assurance

Every OEM/ODM project runs through full-process quality control — dimensional inspection, environmental simulation and aging/burn-in testing — to meet international industrial standards before mass production is released.

• Key equipment: 2D Measuring Instruments (dimensional/tolerance verification)

• Key equipment: HYC-TH-80DH High/Low Temperature & Humidity Test Chamber

• Key equipment: Microscopes & Automated Visual Inspection Systems

• Standard practice: full-spectrum aging test, high-temperature burn-in*

* Burn-in duration is not published on the current OEM/ODM page. A 48-72 hour high-temperature burn-in is referenced elsewhere on HITULCD's site for the 50-inch direct-lit platform; confirm the exact burn-in duration and acceptance criteria applied to your specific project at the quotation stage.

11-Step LCD Bonding Production Process

1. Cell Feeding

2. Vacuum Quenching

3. ACF Attachment

4. IC Alignment & Pre-Bonding

5. FOG Electrical Test

6. FPC Main Bonding

7. FPC Alignment & Pre-Bonding

8. IC Main Bonding

9. ITO Encapsulation

10. High-Temperature Adhesive & Label Attachment

11. Visual Inspection

Product Platforms Available for OEM/ODM Customization

Customizable Parameters

The following parameters can typically be adjusted on an OEM or ODM basis. Exact customization limits (minimum order quantity, tooling cost and lead-time impact) vary by parameter and are confirmed during technical review — see the Engagement Process section below.

* This table reflects the range of customization HITULCD's platforms are engineered to support, based on the published product line. It is not an exhaustive list of every possible modification — always confirm feasibility, MOQ and cost impact for your specific parameter combination with our engineering team.

Certifications & Compliance

* Scope of UL listing (which product families / which UL standard number) is not itemised on the current OEM/ODM page — request the specific UL file number relevant to your product category before specifying it in a tender.

Facilities

• ISO 14644-1 certified cleanroom production environment.

• Modern office, R&D and reception facilities supporting cross-border project collaboration.

• In-house COG/FOG bonding, structural assembly and full reliability-testing lab under one roof — no subcontracted process steps.

Typical OEM/ODM Engagement Process

HITULCD's site does not publish a step-by-step engagement workflow. The sequence below reflects standard industry practice for LCD OEM/ODM projects and is provided as a planning reference — confirm the exact stage-gates, documentation and lead time that HITULCD applies with your account engineer.*

12. Inquiry & NDA — share your project brief; sign a mutual NDA if proprietary specifications are involved.

13. Technical Requirement Review — define size, brightness, touch, interface, enclosure, certification targets and target unit cost.

14. DFM (Design for Manufacturability) Review — HITULCD's engineering team assesses feasibility and proposes an optimized design.

15. Quotation — tooling/NRE cost (if any), unit pricing by volume tier, and estimated lead time are issued.

16. Sample / Prototype Build — first article produced for functional and environmental validation.

17. Sample Approval & Sign-off — customer validates against agreed spec sheet before tooling is locked.

18. Mass Production — production released per confirmed PO, with in-process and pre-shipment QC.

19. Shipment & After-Sales Support — export packaging, shipping per agreed Incoterm, and warranty/support period begins.

* Confirm with HITULCD: typical sample lead time, tooling/NRE cost policy (if a new mold or PCB is required), minimum order quantity for a custom ODM project, and IP ownership terms for any customer-supplied or jointly developed design — none of these are stated on the current OEM/ODM page and should be captured in your quotation or NDA/contract.

Company Verification

Recommended Next Steps Before Starting an OEM/ODM Project

• Prepare a written spec brief: target size, brightness, environment (indoor/semi-outdoor/outdoor), touch requirement, interfaces, target certification markets and expected annual volume.

• Request confirmation of tooling/NRE cost (if any) and who owns the tooling at project end.

• Request the specific UL file number and certificate scope if UL marking is required for your target market.

• Request sample lead time and sample cost/credit-back-on-order policy.

• Sign an NDA before sharing proprietary mechanical drawings, firmware or branding assets.

• Clarify IP ownership of any custom design jointly developed during the ODM process before production sign-off.

Contact: chenhua@hitulcd.com   |   Tel: +86 18682328732   |   www.hitulcd.com