23.1 Inch Strip form TFT LCD Module Manufacturer

Custom-Cut Strip-Form TFT Module — Engineering Overview

Reference: LD230EKE-FPA1 | HITULCD

1. Cutting Process & Feasibility

Cutting method: We select between two processes depending on your tolerance requirements:

• Mechanical wheel cutting — suited to tolerances ≥ ±0.3mm, higher volumes, cost-sensitive programs. Faster, but carries a higher risk of micro-cracking at the edge without post-processing.

• Ultra-fast laser cutting — suited to tight tolerances (down to ±0.1mm), high trace density near the cut line, or programs with strict optical consistency requirements. Cold processing significantly reduces chipping and micro-cracks, and is our default recommendation for stretched-bar formats like this one.

We confirm the final method in a written process proposal before sampling begins, based on your tolerance spec, cut geometry, and volume.

Trace/circuit clearance: Before finalizing a cut line, we verify it does not intersect the panel's Gate/Source trace routing or the active TFT array area, which would cause line defects or functional failure.

To complete a feasibility assessment, we typically need:

• Original panel datasheet (including Gate/Source line layout and TAB/COF bond location)

• Target cut drawing (outline, active area, mounting holes — DXF/DWG preferred)

• Your tolerance requirements for trace clearance near the cut line

Edge finish standard: Post-cut edge flatness is controlled to Ra ≤ 0.5µm, chipping depth ≤ 0.05mm, with 400x microscope inspection to confirm no propagating micro-cracks before the part proceeds.

2. Reliability & Sealing

Sealing process: Cutting removes the panel's original edge seal, so we apply a secondary sealing process — UV dispensing plus edge re-sealing — to restore moisture and leakage protection at the cut edge. Material selection (e.g., low-moisture-absorption UV adhesive vs. epoxy) is adjusted based on your operating environment (indoor/outdoor, humidity exposure).

Reliability testing: Post-cut modules can be qualified to consumer-grade or industrial-grade standards depending on your application, including:

These figures are historical benchmarks from comparable cutting programs; a formal test report is issued during sampling based on your specific structural design.

Optical performance: Light leakage or Mura/color shift at the sealed edge depends primarily on the gap design between the cut line and the backlight module edge. We provide a dark-room leakage inspection report at sampling to confirm the 1–2mm edge zone meets spec — parts that don't pass do not ship.

3. Cost, Yield & Lead Time

NRE & sampling: NRE covers fixture development, cutting parameter tuning, and first-article inspection; the amount depends on cut complexity and trace-clearance difficulty. First sample run (20pcs) typically takes 4–6 weeks.

Mass production: Based on our track record with this type of cutting program, yield at volume can be held to a mainstream industry level — we confirm a specific figure in writing at quotation once cut geometry and trace density are finalized. MOQ varies with customization scope (cutting/brightness/bezel); standard specs start at MOQ 1, and custom-cut MOQ is confirmed at quotation.

Supplier Snapshot

• Legal entity: Shenzhen Hantu Jiashi Technology Co., Ltd. (HITULCD) — established 2014, 11+ years in operation

• Certifications: ISO9001 / CE / FCC / RoHS / REACH; UL / CCC / EAC available on request

• Capacity: 12,000+ units/month; standard lead time 2–3 weeks, custom programs 4–6 weeks

• Warranty: 12 months with engineering support

Send us your cut drawing and application requirements, and our engineering team will begin the feasibility assessment.