28" Custom Bar LCD Display Module (DV28OFBM-NB2)

Technical & Program Overview for OEM Engineers, Procurement Managers and Project Leads

1. Product Overview

This 28" bar-type LCD module is produced from a 32" mother glass panel using a 1/3 custom cutting process, resulting in a 1920 × 360 resolution and an ultra-wide 5.33:1 aspect ratio. It is designed for applications that require an elongated display format — shelf-edge labels, transit/bus passenger information bars, convenience store signage, and equipment status bars.

This document is organized around the three areas most commonly raised by international customers during technical evaluation: cutting process & feasibility, sealing & reliability, and cost/yield/lead time — so your engineering, procurement and project teams can assess the program in a single review.

2. Cutting Process & Feasibility

2.1 Cutting Method Recommendation

For custom sizes such as this 28" (1/3 cut from 32" mother glass), we offer two cutting approaches depending on tolerance requirements and volume:

• Mechanical Wheel Cutting – Best suited for straight-line/rectangular cuts, larger volumes, and cost-sensitive programs. Typical tolerance ±0.3mm. Edge chipping is more pronounced and requires secondary edge treatment.

• Ultra-fast Laser Cutting (cold process) – Recommended when edge micro-crack control, non-linear/irregular profiles, or higher reliability (vehicle, outdoor, industrial) is required. The heat-affected zone is minimal, edge chipping and micro-cracking are significantly reduced, and tolerance can be held within ±0.1mm. Unit cost and sample lead time are higher than mechanical cutting.

We recommend the appropriate method based on the end application (vibration/drop exposure, thermal cycling frequency) rather than cost alone.

2.2 Circuit Layout & Trace Avoidance

Before cutting, our engineering team performs a layout mapping review against the source panel (in this case the 32" mother glass) to confirm the cut line will not intersect the Gate/Source drive traces, the active TFT array area, or the COF/PCB bonding zone — avoiding display defects such as missing rows/columns or bright/dark lines.

To complete the feasibility assessment, we typically request the following from the customer:

1. Target cut dimensions and outline drawing with tolerance requirements (DWG/DXF preferred)

2. Desired active display area position and mechanical/assembly drawing (if available)

3. Connector/interface position requirements (whether trace offset is needed)

4. Application description (indoor/outdoor, vibration exposure, touch requirement)

Once received, we provide a cutting feasibility report within 1–3 business days, confirming whether trace avoidance or a custom driver board is required.

2.3 Edge Finishing Standards

• Edge flatness (chip depth): ≤0.1mm for mechanical cutting, ≤0.05mm for laser cutting

• Micro-crack inspection: laser-cut edges are checked under 50–100x magnification to ensure no through-cracks extend into the active array area

• All cut edges receive chamfering/grinding to remove sharp edges and reduce stress-concentration risk

3. Reliability & Sealing Assurance

3.1 Sealing Process

Custom cutting removes the panel's original frame seal, so secondary edge sealing is mandatory to prevent liquid crystal leakage and moisture ingress.

• UV-cured dispensing/coating is applied along the cut edge to form a protective barrier — suitable for most indoor and outdoor applications

• For high-humidity, outdoor, or vehicle applications, we add a secondary epoxy reinforcement or higher-grade sealant, sized to the customer's required IP rating

3.2 Reliability Testing

Cut modules are validated against the following test program (test levels adjustable between consumer-grade and industrial-grade per project requirements):

Environmental test data from comparable cutting programs (e.g., retail information bars, transit passenger info bars) can be shared under NDA for reference.

3.3 Optical Performance

The main risks after edge sealing are light leakage and Mura/color shift near the cut edge, which are closely tied to backlight film trimming precision and sealant thickness control. We manage these through:

• Precision-trimmed backlight optical films matched to the final cut dimensions

• Standardized sealant thickness to avoid localized color shift from uneven refraction

• 100% lighting inspection before shipment (visual + instrument-based) to check edge Mura and light leakage

4. Cost, Yield & Lead Time

4.1 NRE & Sample Cost

• NRE cost varies with cutting method, trace-avoidance complexity, and sealing process — a quotation is provided within 1–3 business days of receiving the customer's drawing

• First sample lead time (typically 20pcs): approx. 2–3 weeks for standard custom cutting; 3–4 weeks if a custom driver board or non-standard interface is required

4.2 Mass Production Expectations

• Yield: based on comparable cutting programs, mass-production yield typically runs 90%–95%, depending on cut complexity and tolerance (laser-cut programs generally trend higher than mechanical)

• MOQ: 1 unit for standard specs; for custom cutting/brightness/structure changes, MOQ is confirmed at quotation and typically falls in the 100–500 pcs range

• Standard production lead time: 2–3 weeks; custom programs: 4–6 weeks

5. Supplier Qualification

• Legal entity: Shenzhen Hantu Jiashi Technology Co., Ltd. | Unified Social Credit Code: 91440300306068446B

• Established: May 23, 2014 (11+ years in operation) | Registered Capital: RMB 2,000,000

• Factory address: Building B, Gangshen Innovation Park, Huaning Road, Dalang Sub-district, Longhua District, Shenzhen, Guangdong, China

• Certifications: ISO9001 / CE / FCC / RoHS / REACH / WEEE; UL / CCC / EAC available on request

• Production capacity: 12,000+ units/month

• Warranty: 12 months with engineering support

• Payment terms: T/T, L/C, PayPal (samples), O/A (established partners)

• Incoterms: EXW / FOB / CIF

To proceed with a formal feasibility review, please share your target cut outline (DXF/DWG) and application details. Our engineering team will respond with a feasibility assessment and quotation within 1–3 business days.