21.1″ Custom Stretched Bare LCD Panel for Vending Machines

Ultra-wide format · Cut from standard-size TFT-LCD glass · Bare panel (COG/COF + FPC, no driver board)

A stretched (bar-type) LCD panel is produced by precision-cutting a standard, mass-produced TFT-LCD mother panel into a narrow, elongated shape. This gives OEM and vending-machine integrators an eye-catching, space-efficient display format — at a fraction of the tooling cost and lead time of a fully custom cell design — while reusing a proven, high-yield base panel and driver IC.

Note on specifications below: Exact cut-line dimensions, resolution and active area depend on the source panel selected and your mechanical opening. The values marked "typical / reference" follow common industry practice for stretched-panel conversions and should be confirmed against your final drawing (DWG/DXF) before quotation is finalized.

Key Specifications

All values above are typical/reference for this panel class. Final datasheet is issued after DWG confirmation and sample validation.

Why a Cut/Stretched Bare Panel for Vending Machine Applications

• Non-standard bar aspect ratio fits narrow vertical/horizontal ad windows, door strips, and column dividers that no off-the-shelf panel can fill.

• Reuses a proven mother panel and driver IC — no new TFT array tooling, no new mask set, which keeps NRE cost and lead time far below a true custom cell.

• Bare-panel (COG/COF) format gives your team full flexibility to integrate your own AD board, PCAP touch, and mechanical housing.

• High-volume mother-glass supply chain behind it, so long-term supply continuity is significantly better than a fully custom-tooled panel.

Custom Cutting & Sizing Capability — Technical FAQ

Prepared for overseas engineers, sourcing/procurement managers, and project owners evaluating panel-cutting feasibility.

1. Cutting Process & Design Feasibility

Q: What cutting method do you recommend — mechanical wheel cutting or laser cutting?Both are available and selected based on cut-line location and tolerance requirement:

• Mechanical scribe-and-break (wheel cutting): lower cost, shorter lead time, suitable for straight cut lines with standard tolerance (±0.3–0.5 mm typical). Preferred for high-volume, cost-sensitive programs.

• Ultra-fast/UV laser cutting: tighter tolerance (±0.1–0.2 mm typical), lower micro-crack risk, and can cut closer to active circuit areas. Recommended when the cut line is near the Gate/Source driver area, when tolerance is tight, or when the panel has a curved/notched profile.

We confirm the recommended method after reviewing your target dimensions, tolerance class, and cut-line position relative to the active area.

Q: Will the cut interfere with the Gate/Source traces or TFT array area?Every cut-line proposal goes through an internal circuit-layout check against the source panel's Gate driver (row), Source driver (column) and TFT array boundaries before any cutting is approved. If the requested dimension encroaches on active circuit area, we will:

1. Flag the conflict and propose the nearest feasible cut line, or

2. Recommend an alternative source panel/model whose array layout better fits your target dimension.

Q: What do you need from us to evaluate cutting feasibility?To run a feasibility/DFM (Design for Manufacturing) check, please provide:

• Target outline dimension and active-area dimension (with tolerance), in a DWG/DXF or dimensioned PDF drawing

• Preferred mounting orientation and cut-line reference edges

• Required resolution/aspect ratio (or confirmation that partial-image display is acceptable)

• Any keep-out zones (connector location, mounting holes, bezel overlap)

• Target quantity and application environment (indoor/outdoor, temperature range)

Q: What is your edge flatness and micro-crack control standard after cutting?Cut edges are inspected against an internal QC standard covering edge chipping size, edge flatness, and micro-crack length, referencing common glass-processing acceptance criteria (comparable to IPC/JPCA-style optical inspection practice for glass edge quality). Edges exceeding the micro-crack length or chip-depth limit are rejected before sealing. Full inspection criteria (with accept/reject photos) can be shared under NDA.

2. Reliability & Edge Sealing

Q: What sealing process do you use to prevent liquid-crystal leakage and moisture ingress after cutting?Cut edges receive a secondary edge-sealing process — typically UV-cured dispensed sealant applied along the exposed cut edge, forming a moisture and LC-leakage barrier. Depending on the panel structure and customer requirement, we can also apply a supplementary edge-coating/potting step for additional mechanical protection. Process parameters (dispensing width, cure time, sealant type) are validated during first-article sampling.

Q: Can the cut panel pass consumer-grade or industrial-grade reliability testing?Cut-and-sealed panels are qualified against standard environmental and mechanical test protocols before mass production release. Depending on your target grade, we run (or can run) a combination of:

• High-temperature/high-humidity (double-85, 85°C/85%RH) soak test — typically 96–500+ hours depending on grade

• Temperature cycling / thermal shock (e.g., -20°C ↔ +60°C or -30°C ↔ +70°C, multiple cycles) — referencing IEC 60068-2 style test conditions

• Structural drop test for the display module/assembly, per your target application category

We're happy to share benchmark test reports/data from comparable prior cutting programs (panel size and cut ratio similar to your request) once NDA is in place — actual pass/fail thresholds and cycle counts are confirmed against your target quality grade (consumer vs. industrial).

Q: Does light leakage or color shift (Mura) occur near the sealed edge after cutting?This is the primary optical risk in any panel-cutting process, and it is controlled through: (a) precise cut-line placement outside the active display area wherever possible, (b) sealant dispensing control to avoid encroaching on the viewable area, and (c) 100% optical inspection (light-leakage and Mura check) on every cut unit before packing. Any unit showing edge light leakage or visible color shift beyond the agreed AQL is screened out.

3. Cost, Yield & Lead Time

Q: What is the NRE cost to start a custom-cutting project, and how long does first sampling (e.g., 20 pcs) take?Because cutting reuses an existing mother panel and driver IC (no new mask/array tooling), NRE is limited mainly to cutting-fixture/jig setup and process validation — significantly lower than a fully custom cell. Typical first-sample (≈20 pcs) lead time is on the order of 2–4 weeks from drawing confirmation, depending on cut complexity and current line loading. Exact NRE quotation and sample lead time are provided after DFM review of your specific dimension.

Q: What yield can we expect at mass-production stage, and what is your MOQ?Mass-production cutting yield depends on cut-line complexity, tolerance class, and proximity to the active area; straightforward straight-line cuts with standard tolerance in a mature process typically run in the high-80% to mid-90% range, with tighter-tolerance/near-circuit cuts trending toward the lower end of that range until the process is fully qualified on your specific dimension. MOQ for mass production is generally set at the mother-panel batch/tray level for the selected source panel — please share your target volume so we can confirm the applicable MOQ and pricing tier for your program.

Ordering Information

Get a Quote

Send us your target dimension drawing (DWG/DXF), quantity, and application environment, and our engineering team will return a DFM feasibility check, NRE quotation, and sampling lead time within 1–2 business days.

All specifications in this document are typical/reference values for this panel class pending final drawing confirmation and are subject to change based on source panel selection and customer requirements. Contact our sales/engineering team for a project-specific datasheet.